Temperature and Heat Flux Dependence of Thermal Resistance of Water/Metal Nanoparticle Interfaces
Vera, Jesus G
Doctor of Philosophy
Non-equilibrium Molecular Dynamics (MD) simulations of heat transport through nanoscale metallic systems in contact with water are performed to investigate the effects of temperature and heat flux on thermal resistance across the interface. The simulation space is composed of nanometer-scale nanochannels of water between two parallel metallic walls of Gold, Silver, Copper, Aluminum, Nickel, Lead, Palladium, and Platinum. One wall serves as a heat source and the other serves as a heat sink. Simulations are performed at heat source temperatures spanning from 300 K to 650 K and fixed heat sink temperatures of 250 K. Steady-state wall and fluid temperatures at the interfaces and the imposed energy required for maintaining each wall temperature are recorded to measure system heat flux. The interfacial thermal resistance (ITR) is calculated for each wall temperature and metal combination, and the wall temperatures, heat fluxes, and resistance data is presented for all cases where the interfacial water temperature is below boiling. For all metals studied, it was found that an increase in wall temperature resulted in an increase in ITR and an increase in heat flux resulted in a decrease in ITR. Using two- dimensional least squares regression, linear fit coefficients for the calculation of interfacial thermal resistance as a function of wall temperature and heat flux are compiled in order to calculate the interfacial resistances for each metal for a variety of thermal applications.