Because of the electrical insulating properties of polyimide, it is widely used in the packaging of semiconductor chips. However, it has been documented that the electrical resistivity can be decreased by several orders ...

Near field recording on high coercivity FePt intermetallic compound media using a high Bsat write element was investigated. Untextured FePt media were prepared by magnetron sputtering on ZrO2 disks at a substrate temperature ...