Now showing items 1-10 of 45
The electrodeposition of aluminum
Abstract Not Available.
Characterization of VLSI interconnect materials: Mechanical behavior, time-dependent plasticity, and electromigration
Various thin film metallizations were tested in order to gain insight into their performance as VLSI interconnects. Biaxial stress-strain test results exhibited limited ductility, even for pure FCC metals such as copper ...
Development and characterization of a nanofiber-reinforced thermoplastic composite
Polypropylene composites with vapor-grown carbon nanofibers (VGCF's) as reinforcement were prepared. The fibers used have an rage diameter of 200 nm with interesting thermal, electrical and mechanical properties which make ...