Now showing items 11-12 of 12
Factors limiting the accuracy of mechanical-property measurement by nanoindentation
Nanoindentation techniques have been widely used to measure thin film mechanical properties. One of the most commonly used methods of analysis of nanoindentation load and displacement data was developed by Oliver and Pharr. ...
Electrostatic adhesion testing of metallizations on silicon substrates
A novel technique is developed to measure quantitatively the adhesion strength of metallizations deposited on substrates such as silicon. Electrostatic adhesion testing employs electrostatic forces to generate delaminating ...